Synopsys

NVIDIA’s ‘cuLitho’ Computational Lithography Adopted By TSMC and Synopsys For Production Use

Last year, NVIDIA introduced its cuLitho software library, which promises to speed up photomask development by up to 40 times. Today, NVIDIA announced a partnership with TSMC and Synopsys to implement its computational lithography platform for production use, and use the company’s next-generation Blackwell GPUs for AI and HPC applications. The development of photomasks is a…

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OSS leaders detail commitments to bolster software security

The operators of leading open source software (OSS) package repositories, including the Python Software Foundation and the Rust Foundation, have set out the actions they are taking to help better secure and protect the open source software (OSS) ecosystem, underscored by a series of high-profile OSS flaws in the past few years, most notably Log4Shell.…

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TSMC: Importance of Open Innovation Platform Is Growing, Collaboration Needed for Next-Gen Chips

This year TSMC is commemorating 15 years of its Open Innovation Platform, a multi-faceted program that brings together the foundry’s suppliers, partners, and customers to help TSMC’s customers better build innovative chips in an efficient and timely manner. The OIP program has grown over the years and now involves tens of companies and over 70,000…

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TSMC: Ecosystem for 2nm Chip Development Is Nearing Completion

Speaking to partners last week as part of their annual Open Innovation Platform forum in Europe, a big portion of TSMC’s roadshow was dedicated to the next generation of the company’s foundry technology. TSMC’s 2 nm-class N2, N2P, and N2X process technologies are set to introduce multiple innovations, including nanosheet gate-all-around (GAA) transistors, backside power delivery, and super-high-performance…

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TSMC: We Want OSATs to Expand Their Advanced Packaging Capability

Almost since the inception of the foundry business model in the late 1980s, TSMC would produce silicon. In contrast, an outsourced semiconductor assembly and test (OSAT) service provider would then package it into a ceramic or organic encasing. Things have changed in recent years with the emergence of advanced packaging methods that require sophisticated tools…

TSMC: We Want OSATs to Expand Their Advanced Packaging Capability Read More »

TSMC: Ecosystem for 2nm Chip Development Is Nearing Completion

Speaking to partners last week as part of their annual Open Innovation Platform forum in Europe, a big portion of TSMC’s roadshow was dedicated to the next generation of the company’s foundry technology. TSMC’s 2 nm-class N2, N2P, and N2X process technologies are set to introduce multiple innovations, including nanosheet gate-all-around (GAA) transistors, backside power delivery, and super-high-performance…

TSMC: Ecosystem for 2nm Chip Development Is Nearing Completion Read More »

Arm’s Clients and Partners Signal Interest to Invest $735 Million Ahead of IPO

According to fresh SEC filings from Arm, the chip IP designer has secured a slew of industry investors ahead of the company’s impending IPO. Aiming for a strong start to what Reuters reports is projected to be a $52 billion IPO valuation, Arm has been seeking out major industry customers as cornerstone investors, successfully lining…

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Synopsys Surpasses $500M/Year in AI Chip Revenue, Expects Further Rapid Growth

Demand for generative artificial intelligence (AI) applications is so high that NVIDIA’s high-performance compute GPUs like A100 and H100 are reportedly sold out for quarters to come. Dozens of companies are developing AI-oriented processors these days and, like the gold rushes of old, the tool suppliers are some of the biggest winners. As part of…

Synopsys Surpasses $500M/Year in AI Chip Revenue, Expects Further Rapid Growth Read More »

Intel and Synopsys Ink Deal to Develop IP for Intel’s 3 and 18A Nodes

Intel and Synopsys this week signed an agreement under which Synopsys will develop a portfolio of various IP offerings for Intel 3 and 18A fabrication technologies for Intel Foundry Services (IFS) customers. The availability of industry-standard IP from Synopsys will significantly simplify the development of chips for both current and potential IFS customers. A noteworthy…

Intel and Synopsys Ink Deal to Develop IP for Intel’s 3 and 18A Nodes Read More »

Dozens of Companies Adopt TSMC’s 3nm Process Technology

Designing chips for modern, leading-edge manufacturing technologies is an expensive endeavor. Still, dozens of companies have already adopted TSMCs N3 and N3E (3 nm-class) fabrication processes, according to disclosures made by TSMC and Synopsys. “Synopsys IP for TSMC’s 3nm process has been adopted by dozens of leading companies to accelerate their development time, quickly achieve silicon…

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