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MiTAC/Tyan Shows Off Motherboard and Servers for Intel’s Xeon 6 CPUs

Later this year Intel is set to introduce its Xeon 6-branded processors, codenamed Granite Rapids (6x00P) and Sierra Forest (6x00E). And with it will come a new slew of server motherboards and pre-built server platforms to go with it. On the latter note, this will be the first generation where Intel won’t be offering any pre-builts…

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The XPG Core Reactor II VE 850W PSU Review: Our First ATX 3.1 Power Supply

Just over 18 months ago, Intel launched their significantly revised ATX v3.0 power supply standard, and with it, the 600 Watt-capable 12VHPWR cable to power video cards and other high-drain add-in cards. The release of the standard came with a lot of fanfare and excitement – the industry was preparing for a future where even…

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TSMC Readies Next-Gen HBM4 Base Dies, Built on 12nm and 5nm Nodes

Of the several major changes coming with HBM4 memory, one of the most immediate is the sheer width of the memory interface. With the fourth-generation memory standard moving from an already wide 1024-bit interface to a ultra-wide 2048-bit interface, HBM4 memory stacks won’t be business as usual; chip manufacturers are going to need to adopt…

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Apple M4 chip: everything we know so far about Apple’s new chip

Apple officially announced its latest silicon, the Apple M4, at its May ‘Let Loose’ event, the first time the company has announced a new chip in a tablet without first bringing it to its Mac desktops and laptops.We’ve got a good bit of detail on the Apple M4 thanks to the announcement as well as…

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Intel Teases Lunar Lake CPU Ahead of Computex: Most Power Efficient x86 Chip Yet

The next few weeks in the PC industry are going to come fast and furious. Between today and mid-June are multiple conferences and trade-shows, including Microsoft Build and the king of PC trade shows: Computex Taiwan. With all three PC CPU vendors set to present, there’s a lot going on, and a lot of product…

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TSMC to Expand CoWoS Capacity by 60% Yearly Through 2026

Customer demand for AI and HPC processors is driving a much greater use of advanced packaging technologies, particularly TSMC’s chip-on-wafer-on-substrate (CoWoS) services. As things stand, TSMC is just barely meeting the current demand for this packaging method – never mind future demand – which is why last year the company announced plans to more than double CoWoS…

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Rapidus Adds Chip Packaging Services to Plans for $32 Billion 2nm Fab

To say that the global foundry market is booming right now would be an understatement. Demand for leading-edge process technologies driven by AI and HPC applications is unprecedented, and with Intel joining the contract chipmaking game, this market segment is once again becoming rather competitive as well. Yet, this is exactly the market segment that…

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The Intel Core Ultra 7 155H Review: Meteor Lake Marks A Fresh Start To Mobile CPUs

One of the most significant events of last six months in mobile computing has been Intel and the launch of their disaggregated Meteor Lake SoC architecture. Meteor Lake, along with the new Core and Core Ultra product brands, heralds the dawn of Intel’s first chiplet architecture for mass-market mobile devices, courtesy of the Intel 4…

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Toshiba shows 32TB HDDs with heat-assisted and shingled drives

By Published: 20 May 2024 12:22 Toshiba has demoed 32TB (terabyte) and 31TB hard disk drives (HDD) that use heat- and microwave-assisted magnetic recording (HAMR and MAMR) plus shingled drive tracks to boost capacity over existing products by more than 40%. Currently, Toshiba’s largest capacity drive is a 22TB non-shingled MAMR model. Hard drive manufacturer…

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TSMC Posts Q1’24 Results: 3nm Revenue Share Drops Steeply, but HPC Share Rises

Taiwan Semiconductor Manufacturing Co. this week released its financial results for Q1 2024. Due to a rebound in demand for semiconductors, the company garned $18.87 billion in revenue for the quarter, which is up 12.9% year-over-year, but a decline of 3.8% quarter-over-quarter. The company says that in increase in demand for HPC processors (which includes…

TSMC Posts Q1’24 Results: 3nm Revenue Share Drops Steeply, but HPC Share Rises Read More »

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