Although TSMC can’t claim to be the first fab to use extreme UV (EUV) lithography – that title goes to Samsung – they do get to claim to be the largest. As a result, the company has developed significant experience with EUV over the years, allowing TSMC to refine how they use EUV tooling to…
TSMC Outlines Path to EUV Success: More Tools, More Wafers, & Best Pellicles In Industry Read More »
Intel’s Meteor Lake series of processors has had a drawn-out launch since its details were officially revealed in September 2023. The series marks Intel’s foray into the consumer market with a tile-based chiplet configuration held together with Foveros packaging. Similar to Tiger Lake, the focus of Meteor Lake has primarily been on the mobile market…
To say that the global foundry market is booming right now would be an understatement. Demand for leading-edge process technologies driven by AI and HPC applications is unprecedented, and with Intel joining the contract chipmaking game, this market segment is once again becoming rather competitive as well. Yet, this is exactly the market segment that…
Rapidus Adds Chip Packaging Services to Plans for $32 Billion 2nm Fab Read More »
Following the magnitude 7.2 earthquake that struck Taiwan on April 3, 2024, there was immediate concern over what impact this could have on chip production within the country. Even for a well-prepared country like Taiwan, the tremor was the strongest quake to hit the region in 25 years, making it no small matter. But, according…
Report: Impact of Taiwanese Earthquake on DRAM Output to be Negligible in Q2 Read More »
SK hynix is one of the few vertically integrated manufacturers in the flash-based storage market (along with Samsung, Micron / Crucial, Western Digital, and Kioxia). The company is well-established in the OEM market. A few years back, they also started exploring direct end-user products. Internal SSDs (starting with the Gold S31 and Gold P31) were…
SK hynix Tube T31 Stick SSD Review: Bridging Solution Springs A Surprise Read More »
With NVIDIA’s Turing architecture turning six years old this year, the company has been retiring many of the remaining Turing products from its video card lineup. And today that spirit of spring cleaning is coming to the entry-level segment of NVIDIA’s professional visualization lineup, where NVIDIA is introducing a pair of new desktop cards based…
NVIDIA Intros RTX A1000 and A400: Entry-Level ProViz Cards Get Ray Tracing Read More »
Samsung Electronics this week was awarded up to $6.4 billion from the U.S. government under the CHIPS and Science Act to build its new fab complex in Taylor, Texas. This is the third major award under the act in the last month, with all three leading-edge fabs – Intel, TSMC, and now Samsung – receiving multi-billion…
Samsung To Receive $6.4 Billion Under CHIPS Act to Build $40 Billion Fab in Texas Read More »
Samsung today has announced that they have developed an even faster generation of LPDDR5X memory that is set to top out at LPDDR5X-10700 speeds. The updated memory is slated to offer 25% better performance and 30% greater capacity compared to existing mobile DRAM devices from the company. The new chips also appear to be tangibly…
Hisense has made a name for itself in the value television market. Need a TV with some newer features but don’t want to pay the price premium that comes with something from Samsung, Sony, or LG? Hisense is there with a television that is much cheaper.Now, the company wants to take a shot across the…
Hisense’s CanvasTV is a direct competitor to Samsung’s The Frame at a lower price Read More »
Samsung Electronics has started mass production of its 9th generation of V-NAND memory. The first dies based on their latest NAND tech come in a 1 Tb capacity using a triple-level cell (TLC) architecture, with data transfer rates as high as 3.2 GT/s. The new 3D TLC NAND memory will initially be used to build…
Samsung Starts Mass Production of 9th Generation V-NAND: 1Tb 3D TLC NAND Read More »
