TSMC to Build $2.87 Billion Facility For Advanced Chip Packaging
TSMC on Tuesday announced plans to construct a new advanced chip packaging facility in Tongluo Science Park. The company intends to spend around $2.87 billion on the fab that will employ some 1,500 people when it becomes operational several years from now. “To meet market needs, TSMC is planning to establish an advanced packaging fab…
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