Micron has reaffirmed plans to start shipments of its HBM3E memory in high volume in early 2024, while also revealing that NVIDIA is one of its primary customers for the new RAM. Meanwhile, the company stressed that its new product has been received with great interest by the industry at large, hinting that NVIDIA will…
Micron to Ship HBM3E Memory to NVIDIA in Early 2024 Read More »
This year TSMC is commemorating 15 years of its Open Innovation Platform, a multi-faceted program that brings together the foundry’s suppliers, partners, and customers to help TSMC’s customers better build innovative chips in an efficient and timely manner. The OIP program has grown over the years and now involves tens of companies and over 70,000…
High-bandwidth memory has been around for about a decade, and throughout its its continued development it has steadily increased in speed, starting at a data transfer rate from 1 GT/s (the original HBM) and reaching upwards of 9 GT/s with the forthcoming HBM3E. This has made for an impressive jump in bandwidth in less than…
HBM4 in Development, Organizers Eyeing Even Wider 2048-Bit Interface Read More »
As Intel continues to refocus on its core competencies, the company has been no stranger to shedding business units and jobs in the process. And while the roughly 132,000 headcount company hasn’t enacted any massive layoffs, there have been numerous cuts at all levels over the past couple of years, with these layoffs now extending…
Intel Cuts Some R&D Positions in California to Reduce Costs Read More »
On Friday, SK Hynix said it had started mass production of 24 GB LPDDR5X memory stacks that can be used for ultra-high-end smartphones and PCs. The company’s LPDDR5X-8500 devices combine ultra-high-performance with high density, thus enabling fast systems with sufficient memory capacity. SK Hynix says such modules could be used well beyond smartphones, PCs, and…
SK Hynix Launches 24GB LPDDR5X-8500 Stacks for Smartphones, PCs, and HPC Read More »
TrendForce projects a remarkable 105% increase in annual bit shipments of high-bandwidth memory (HBM) this year. This boost comes in response to soaring demands from AI and high-performance computing processor developers, notably Nvidia, and cloud service providers (CSPs). To fulfill demand, Micron, Samsung, and SK Hynix are reportedly increasing their HBM capacities, but new production lines will likely start operations…
Memory Makers on Track to Double HBM Output in 2023 Read More »
SK Hynix showcased its 321-layer TLC NAND memory at the Flash Memory Summit 2023. The South Korean company is the first NAND maker to publicly demonstrate 3D NAND with over 300 layers. Although such memory is expected in mass production in 2025, the demonstration is meant to showcase SK Hynix’s preparedness for the next wave of non-volatile memory technology. This showcased 321-layer 3D NAND…
