SK Hynix

SK hynix Wraps up Dev Work on High-End PCB01 PCIe 5.0 SSD for OEMs, Launching Later This Year

SK hynix early in Friday announced that the company has finished the development of it’s PCB01 PCIe Gen5 SSD, the company’s forthcoming high-end SSD for OEMs. Based on the company’s new Alistar platform, the PCB01 is designed to deliver chart-topping performance for client machines. And, as a sign of the times, SK hynix is positioning…

SK hynix Wraps up Dev Work on High-End PCB01 PCIe 5.0 SSD for OEMs, Launching Later This Year Read More »

Samsung Joins The 60 TB SSD Club, Looking Forward To 120 TB Drives

Multiple companies offer high-capacity SSDs, but until recently, only two companies offered high-performance 60 TB-class drives with a PCIe interface: Solidigm and Western Digital. As our colleagues from Blocks & Files discovered, Samsung quietly rolled out its BM1743 61.44 TB solid-state drive in mid-June and now envisions 120 TB-class SSDs based on the same platform. Samsung’s BM1743…

Samsung Joins The 60 TB SSD Club, Looking Forward To 120 TB Drives Read More »

TSMC Readies Next-Gen HBM4 Base Dies, Built on 12nm and 5nm Nodes

Of the several major changes coming with HBM4 memory, one of the most immediate is the sheer width of the memory interface. With the fourth-generation memory standard moving from an already wide 1024-bit interface to a ultra-wide 2048-bit interface, HBM4 memory stacks won’t be business as usual; chip manufacturers are going to need to adopt…

TSMC Readies Next-Gen HBM4 Base Dies, Built on 12nm and 5nm Nodes Read More »

Micron Sells Out Entire HBM3E Supply for 2024, Most of 2025

Being the first company to ship HBM3E memory has its perks for Micron, as the company has revealed that is has managed to sell out the entire supply of its advanced high-bandwidth memory for 2024, while most of their 2025 production has been allocated, as well. Micron’s HBM3E memory (or how Micron alternatively calls it,…

Micron Sells Out Entire HBM3E Supply for 2024, Most of 2025 Read More »

Thinking of buying an SSD? Drives could soon get a lot pricier, so don’t hang around

The chatter about SSD prices going up has become a chorus of voices in recent times – and here’s another report chiming in, underlining the likelihood that solid-state drives will become more expensive soon enough.German tech site Computerbase (via PC Gamer) highlighted a report from The Chosun Daily, a South Korean newspaper, claiming that Samsung…

Thinking of buying an SSD? Drives could soon get a lot pricier, so don’t hang around Read More »

SK hynix Ships LPDDR5T: 9600 MT/s Memory for Smartphones

SK hynix had started volume shipments of its LPDDR5T-9600 memory for high-end smartphones, the company announced this week. So far, the company’s LPDDR6 ‘Turbo’ memory with a 9600 MT/s data transfer speed has been certified to work with two range-topping mobile application processors from Qualcomm and MediaTek. SK hynix’s LPDDR5T-9600 memory is available in 16…

SK hynix Ships LPDDR5T: 9600 MT/s Memory for Smartphones Read More »

AMD Ryzen Threadripper 7980X & 7970X Review: Revived HEDT Brings More Cores of Zen 4

AMD’s Ryzen Threadripper 7000 processors mark the latest additions to the high-end desktop (HEDT) market, a segment AMD wants to bring back to the mainstream. Based on AMD’s proven Zen 4 architecture and built on TSMC’s 5nm process, both of AMD’s new Ryzen Threadripper 7000 lineups – Pro and non-Pro – are designed to bring more cores…

AMD Ryzen Threadripper 7980X & 7970X Review: Revived HEDT Brings More Cores of Zen 4 Read More »

Micron to Ship HBM3E Memory to NVIDIA in Early 2024

Micron has reaffirmed plans to start shipments of its HBM3E memory in high volume in early 2024, while also revealing that NVIDIA is one of its primary customers for the new RAM. Meanwhile, the company stressed that its new product has been received with great interest by the industry at large, hinting that NVIDIA will…

Micron to Ship HBM3E Memory to NVIDIA in Early 2024 Read More »

TSMC: Importance of Open Innovation Platform Is Growing, Collaboration Needed for Next-Gen Chips

This year TSMC is commemorating 15 years of its Open Innovation Platform, a multi-faceted program that brings together the foundry’s suppliers, partners, and customers to help TSMC’s customers better build innovative chips in an efficient and timely manner. The OIP program has grown over the years and now involves tens of companies and over 70,000…

TSMC: Importance of Open Innovation Platform Is Growing, Collaboration Needed for Next-Gen Chips Read More »

HBM4 in Development, Organizers Eyeing Even Wider 2048-Bit Interface

High-bandwidth memory has been around for about a decade, and throughout its its continued development it has steadily increased in speed, starting at a data transfer rate from 1 GT/s (the original HBM) and reaching upwards of 9 GT/s with the forthcoming HBM3E. This has made for an impressive jump in bandwidth in less than…

HBM4 in Development, Organizers Eyeing Even Wider 2048-Bit Interface Read More »

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