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Qualcomm Adds Snapdragon 7s Gen 3: Mid-Tier Snapdragon Gets Cortex-A720 Treatment

Qualcomm this morning is taking the wraps off of a new smartphone SoC for the mid-range market, the Snapdragon 7s Gen 3. The second of Qualcomm’s down-market ‘S’ tier Snapdragon 7 parts, the 7s series is functionally the entry-level tier for the Snapdragon 7 family – and really, most Qualcomm-powered handsets in North America. With…

Qualcomm Adds Snapdragon 7s Gen 3: Mid-Tier Snapdragon Gets Cortex-A720 Treatment Read More »

This 10-inch tri-fold smartphone is thinner than the Galaxy Z Fold 6

While Samsung is struggling to make ultra-thin foldable phones similar to some of its competitors from China, we’ve seen proof that some companies are already developing tri-fold foldable smartphones. Huawei and Xiaomi are already rumored to unveil such foldables in the near future, with the former’s device having already appeared in leaked images.But we don’t…

This 10-inch tri-fold smartphone is thinner than the Galaxy Z Fold 6 Read More »

Samsung unveils glasses-free 3D monitor at Gamescom 2024

Samsung just unveiled its latest gaming monitors during Gamescom 2024. One of the models, the Odyssey 3D, offers glasses-free 3D viewing.“We are thrilled to present our glasses-free 3D gaming monitor at Gamescom, the world’s largest gaming exhibition,” said Hoon Chung, Executive Vice President of Enterprise Business Team, Visual Display Business at Samsung Electronics. “Samsung remains…

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iPhone 16: Release date, rumors, features, A18, price, AI, and more

After the iPhone 15 release, we turn our attention to Apple’s upcoming iPhone 16. The company will unveil this new device during its Glowtime event on September 9. One of the highlights could be an iPhone Ultra model, although it seems AI will be the main feature of this lineup. That said, is the iPhone…

iPhone 16: Release date, rumors, features, A18, price, AI, and more Read More »

Samsung Shrinks LPDDR5X Chips by 9%, Now Just 0.65mm Thick

Samsung is announcing today that it has begun mass production of 12 GB and 16 GB LPDDR5X modules in the industry’s thinnest package. Samsung’s shrunken memory packages measure approximately 0.65 mm in thickness, making them 0.06 mm (~9%) thinner than standard LPDDR5X packages. The company expects the new DRAM devices to be used to make…

Samsung Shrinks LPDDR5X Chips by 9%, Now Just 0.65mm Thick Read More »

Solidigm D7-PS1010 and D7-PS1030: PCIe 5.0 and 176L TLC Datacenter SSD Performance Play

Solidigm’s datacenter SSD lineup includes models targeting different performance, endurance, and cost tradeoffs. Last year, the company had introduced the D5-P5336 QLC drive as a low-cost high-capacity drive for read-heavy workloads, while also preparing the SLC-based D7-P5810 for extremely write-intensive workloads requiring high endurance. The D7-P5520 / D7-P5620 Gen 4 drives with Solidigm’s own 144L…

Solidigm D7-PS1010 and D7-PS1030: PCIe 5.0 and 176L TLC Datacenter SSD Performance Play Read More »

Intel 18A Status Update: First Chips Booting, First External Customer Tape-Out in H1’25

Following Intel’s painful Q2 earnings call and the announcement of their 2025 cost reduction plan last week, it has become increasingly evident that Intel’s future is in the hands of their foundry group. Between Intel’s IDM 2.0 initiative and their internal chip production plans, all roads lead back to Intel retaking – and retaining –…

Intel 18A Status Update: First Chips Booting, First External Customer Tape-Out in H1’25 Read More »

Western Digital Teases 128 TB Enterprise SSD: BiCS8 3D QLC for AI Workloads

A week after Western Digital confirmed that it had begun sampling of its 64 TB SSDs for datacenters, the company has teased its next-generation product, a 128 TB solid-state drive at FMS 2024. For now, all we know about Western Digital’s 128 TB SSD is that it uses the company’s BiCS8 QLC NAND memory and…

Western Digital Teases 128 TB Enterprise SSD: BiCS8 3D QLC for AI Workloads Read More »

U.S. Signs $1.5B in CHIPS Act Agreements With Amkor and SKhynix for Chip Packaging Plants

Under the CHIPS & Science Act, the U.S. government provided tens of billions of dollars in grants and loans to the world’s leading maker of chips, such as Intel, Samsung, and TSMC, which will significantly expand the country’s semiconductor production industry in the coming years. However, most chips are typically tested, assembled, and packaged in…

U.S. Signs $1.5B in CHIPS Act Agreements With Amkor and SKhynix for Chip Packaging Plants Read More »

Micron Expands Datacenter DRAM Portfolio with MR-DIMMs

The compute market has always been hungry for memory bandwidth, particularly for high-performance applications in servers and datacenters. In recent years, the explosion in core counts per socket has further accentuated this need. Despite progress in DDR speeds, the available bandwidth per core has unfortunately not seen a corresponding scaling. The stakeholders in the industry…

Micron Expands Datacenter DRAM Portfolio with MR-DIMMs Read More »

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