Customer demand for AI and HPC processors is driving a much greater use of advanced packaging technologies, particularly TSMC’s chip-on-wafer-on-substrate (CoWoS) services. As things stand, TSMC is just barely meeting the current demand for this packaging method – never mind future demand – which is why last year the company announced plans to more than double CoWoS…
TSMC to Expand CoWoS Capacity by 60% Yearly Through 2026 Read More »
To say that the global foundry market is booming right now would be an understatement. Demand for leading-edge process technologies driven by AI and HPC applications is unprecedented, and with Intel joining the contract chipmaking game, this market segment is once again becoming rather competitive as well. Yet, this is exactly the market segment that…
Rapidus Adds Chip Packaging Services to Plans for $32 Billion 2nm Fab Read More »
One of the most significant events of last six months in mobile computing has been Intel and the launch of their disaggregated Meteor Lake SoC architecture. Meteor Lake, along with the new Core and Core Ultra product brands, heralds the dawn of Intel’s first chiplet architecture for mass-market mobile devices, courtesy of the Intel 4…
The Intel Core Ultra 7 155H Review: Meteor Lake Marks A Fresh Start To Mobile CPUs Read More »
By Published: 20 May 2024 12:22 Toshiba has demoed 32TB (terabyte) and 31TB hard disk drives (HDD) that use heat- and microwave-assisted magnetic recording (HAMR and MAMR) plus shingled drive tracks to boost capacity over existing products by more than 40%. Currently, Toshiba’s largest capacity drive is a 22TB non-shingled MAMR model. Hard drive manufacturer…
Toshiba shows 32TB HDDs with heat-assisted and shingled drives Read More »
Taiwan Semiconductor Manufacturing Co. this week released its financial results for Q1 2024. Due to a rebound in demand for semiconductors, the company garned $18.87 billion in revenue for the quarter, which is up 12.9% year-over-year, but a decline of 3.8% quarter-over-quarter. The company says that in increase in demand for HPC processors (which includes…
TSMC Posts Q1’24 Results: 3nm Revenue Share Drops Steeply, but HPC Share Rises Read More »
AMD is looking to drive the AI PC market with options across multiple product lines, which aren’t limited to consumer processors. While primarily designed for the commercial sector, AMD has announced the Ryzen Pro 8000 ‘Phoenix’ series of APUs for desktops, which AMD claims is the first professional-grade CPU to include an NPU designed to provide…
AMD Announces Ryzen Pro 8000 and Ryzen Pro 8040 Series CPUs: Commercial Desktop Gets AI Read More »
Remember the RTX 4090 cable-melting fiasco? Way back in November 2022, following the launch of Nvidia’s mighty new flagship RTX 4090 graphics card, there were scattered reports of the GPU’s power connector overheating and melting, effectively rendering the $1,599 (£1,519/AU$2,959) component unusable. Now, almost a year and a half later, it looks like the problem…
Artificial intelligence (AI) and machine learning (ML) promises a step change in the automation fundamental to IT, with applications ranging from simple chatbots to almost unthinkable levels of complexity, content generation and control. Storage forms a key part of AI, to supply data for training and store the potentially huge volumes of data generated, or…
Storage technology explained: AI and data storage Read More »
Here’s some bad news for those looking at buying a new hard drive – prices are about to rise, by the looks of things.And that holds true even for consumer hard drives, even though this news – which comes via a report from analyst firm TrendForce – relates to large capacity hard drives in the…
Hard drives could be about to get more expensive – and we have AI to blame Read More »
Taiwan Semiconductor Manufacturing Co. provided several important updates about its upcoming process technologies at its North American Technology Symposium 2024. At a high level, TSMC’s 2 nm plans remain largely unchanged: the company is on track to start volume production of chips on it’s first-generation GAAFET N2 node in the second half of 2025, and N2P…
TSMC 2nm Update: N2 In 2025, N2P Loses Backside Power, and NanoFlex Brings Optimal Cells Read More »
